reference spec. no. jenf243e-9101a-01 p 1 / 9 murata mfg. co., ltd. reference only chip emifil ? lc combined type for large current nfe61ht 2a9 reference specification [aec-q200] 1. scope this reference specification applies to chip emifil ? lc combined type for large current nfe61h series for automotive electronics based on aec-q200 . 2. part numbering nf e 61 ht 101 z 2a 9 l product id structure dimension features capacitance characteristics rated electrode packaging (l ?? w) voltage code (l: taping / b: bulk) 3. rating customer part number murata part number capacitance rated voltage withstanding voltage rated current insulation resistance esd rank 2:2kv NFE61HT330U2A9L 33pf 30% 100 v (dc) 250 v(dc) 2 a(dc) 1000 m ? min. 2 nfe61ht330u2a9b nfe61ht680r2a9l 68pf 30% nfe61ht680r2a9b nfe61ht101z2a9l 100pf 30% nfe61ht101z2a9b nfe61ht181c2a9l 180pf 30% nfe61ht181c2a9b nfe61ht361c2a9l 360pf 20% nfe61ht361c2a9b nfe61ht681d2a9l 680pf 30% nfe61ht681d2a9b nfe61ht102f2a9l 1000pf % nfe61ht102f2a9b nfe61ht332z2a9l 3300pf % nfe61ht332z2a9b ? operating temperature: - 55 c to + 125 c ? storage temperature: - 55 c to + 125 c 4. standard testing condition temperature : ordinary temp. 15c to 35c temperature: 20c 2c humidity : ordinary humidity 25 %(rh) to 85 %(rh) humidity : 60 %(rh) to 70 %(rh) atmospheric pressure : 86kpa to 106kpa 5. style and dimensions equivalent circuit unit mass(typical value) 0.062g note : gap and bend between ceramic capacitor( ? ) and ferrite bead( ? 1) may come out as illustrated below, however, these are not affect the performance, mounting and reliability of the products. input output gnd ? (1),(3):no polarity (1) (3) (2) 6.8 1.60.3 0.70.2 2.60.3 (1) (2) (3) 1.60.3 1.60.3 0.70.2 0.3 0.5 0.1 max. ? ? 1 0.5 max. ? ? 1 (in mm)
reference spec. no. jenf243e-9101a-01 p 2 / 9 murata mfg. co., ltd. reference only insertion loss characteristics (i.l.) (typ.) (50 system) 6. marking no marking. 7. electrical performance no. item specification test method 7.1 capacitance meet item 3. table 1 capacitance voltage frequency 33,68,100 (pf) 1 to 5 v(rms) 1mhz10% 180,360,680 1000,3300 (pf) 10.2 v(rms) 1khz10% 7.2 insulation resistance(i.r.) meet item 3. voltage : 100 v(dc) time : 60 5 seconds 7.3 withstanding voltage products shall not be damaged. test voltage : 250 v(dc) testing time : 1 to 5 seconds limit the charging current: 10ma max. 7.4 resistance to surge voltage meet table 2. table 2 attenuating transient voltage of exponential function shall be applied to products on the condition. peak voltage : 400 v force period : 1 s the number of surges : 10 5 appearance no damaged cap. change 33,68,100 180,360 680 (pf) within 15% 1000 3300 (pf) within 30% i.r. 1000 m ? 8. q200 requirement 8-1. performance (based on table 13 for ferrite emi suppressors/filters) aec-q200 rev.d issued june. 1 2010 aec-q200 murata specification / deviation no. stress test method 3 high temperature exposure (storage) 1000hours at 125c set for 24hours at room temperature, then measured. meet table a after testing. table a appearance no damage capacitance change (33pf-100pf: 1mhz+/-10%) (180pf-3300pf: 1khz+/-10%) 33pf to 680pf within +/-15% at 20c 1000pf to 3300pf within +/-30% at 20c i.r. 1000m ohm min. withstanding voltage no damage relay 10 ? product 100 ? 0.47f e 1 23 400v b e b
reference spec. no. jenf243e-9101a-01 p 3 / 9 murata mfg. co., ltd. reference only aec-q200 murata specification / deviation no. stress test method 4 temperature cycling 1000cycles(-55c to 125c) measurement at 242 hours after test conclusion. meet table b after testing . table b appearance no damage capacitance change (33pf-100pf: 1mhz+/-10%) (180pf-3300pf: 1khz+/-10%) 33pf to 680pf within +/-15% at 20c 1000pf to 3300pf within +/-30% at 20c i.r. 100m ohm min withstanding voltage no damage 5 destructive physical analysis per eia469 no electrical tests no defects 7 biased humidity 1000hours 85c/85%rh. apply maximum rated voltage and current. measurement at 24+/-2 hours after test conclusion. meet table b after testing. 8 operational life 1000hours at 125c apply maximum rated current. measurement at 24+/-2 hours after test conclusion. meet table b after testing. 9 external visual visual inspection no abnormalities 10 physical dimension meet item 4 (style and dimensions) no defects 12 resistance to solvents per mil-std-202 method 215 not applicable 13 mechanical shock per mil-std-202 method 213 figure 1 of method 213. condition f(1500g's/0.5ms/half sine) three times each 6 direction. meet table a after testing. 14 vibration 5g's for 20 minutes, 12cycles each of 3 oritentations osscillation frequency : 10-2000hz. meet table a after testing. 15 resistance to soldering heat no heating. 260c +/- degree c immersion time 10s pre-heating: 150c+/-5c, 60s+/-5s meet table a after testing. 17 esd per aec-q200-002 meet table c after testing. esd rank: refer to item 3. rating. table c appearance no damage i.r. 1000m ohm min withstanding voltage no damage 18 solderbility per j-std-002 method b : not applicable 75% of the terminations is to be soldered. 19 electrical characterization measured :capacitance no defects
reference spec. no. jenf243e-9101a-01 p 4 / 9 murata mfg. co., ltd. reference only 4.00.1 2.00.05 ? 1.5 12.00.3 5.50.05 1.75 +0.1 -0 1.750.1 0.30.1 7.20.1 1.90.1 (in mm) 0.1 4.00.1 sprocket hole embossed cavity direction of feed aec-q200 murata specification / deviation no. stress test method 20 flammability per ul-94 not applicable 21 board flex epoxy-pcb(1.6mm) deflection 2mm(min) 60s minimum holding time meet table d after testing. table d capacitance change (33pf-100pf: 1mhz+/-10%) (180pf-3300pf: 1khz+/-10%) 33pf to 680pf within +/-15% at 20c 1000pf to 3300pf within +/-30% at 20c 22 terminal strength per aec-q200-006 a force of 17.7n for 60sec 17.7n for 60sec no defects 30 electrical transient conduction per iso-7637-2 not applicable 10. specification of packaging 10.1. appearance and dimensions (12mm-wide plastic tape) 10.2. specification of taping (1) packing quantity (standard quantity) 2500 pcs. / reel (2) packing method products shall be packaged in the cavity of the plastic tape and sealed with cover tape. (3) sprocket hole the sprocket holes are to the right as the tape is pulled toward the user. (4) spliced point the cover tape have no spliced point. (5) missing components number missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not continuous . the specified quantity per reel is kept. 10.3. pull strength of plastic tape and cover tape plastic tape 5n min. cover tape 10n min. 10.4. peeling off force of cover tape 0.2n to 0.7n (minimum value is typical) ? speed of peeling off : 300 mm / min 165 ~ 180 f cover tape plastic tape dimension of the cavity is measured at the bottom side.
reference spec. no. jenf243e-9101a-01 p 5 / 9 murata mfg. co., ltd. reference only 10.5. dimensions of leader-tape, trailer and reel there shall be leader-tape (cover tape only and empty tape) and trailer-tape (empty tape) as follows. (in: mm) 10.6. marking for reel customer part number , murata part number , inspection number( ? 1) , rohs marking( ? 2) , quantity , etc ? 1) ? expression of inspection no. ? oooo ??? (1) (2) (3) (1) factory code (2) date first digit : year / last digit of year second digit : month / jan. to sep. ? 1 to 9, oct. to dec. ? o, n, d third, fourth digit : day (3) serial no. ? 2) ? expression of rohs marking ? rohs ? y ( ) (1) (2) (1) rohs regulation conformity parts. (2) murata classification number 10.7. marking for outside package (corrugated paper box) customer name , purchasing order number , cu stomer part number , murata part number , rohs marking ( ? 2) , quantity , etc 10.8. specification of outer case outer case dimensions (mm) standard reel quantity in outer case (reel) w d h 186 186 93 4 ?? above outer case size is typical. it depends on a quantity of an order. empty tape 190 min. leader trailer 2.00.5 ? 13.00.2 ? 21.00.8 ? 180 ? 60 13 171.4 1 0 0 3 direction of feed 210 min. 160 min. 1 0 cover tape label w d label h
reference spec. no. jenf243e-9101a-01 p 6 / 9 murata mfg. co., ltd. reference only 11. standard land dimensions the chip emi filter suppresses noise by conducting the high-frequency noise element to ground. therefore, to get enough noise reduction, feed thro ugh holes which is connected to ground-plane should be arranged according to the figure to re inforce the ground-pattern. (a) standard land dimensions for re flow (b) standard land dimensions for flow (but, nfe61ht332z2a9 is not applicable.) ? side on which chips are mounted ? side on which chips are mounted 12. ! caution limitation of applications please contact us before using our products for the ap plications listed below which requ ire especially high reliability fo r the prevention of defects which might directly cause damage to the third party?s life, body or property. (1)aircraft equipment (2)aerospace equipment (3)undersea equipment (4)power plant control equipment (5)medical equipment (6)transportation equipm ent(trains, ships, etc.) (7)traffic signal equipment (8)disaster prevention / crime prevention equipment (9)data-processing equipment (10)applications of similar complexity or with reliabilit y requirements comparable to th e applications listed in the above 13.notice this product is designed for solder mounting. please consult us in advance for applying other mounting method such as conductive adhesive. ? 13.1. flux and solder flux use rosin-based flux, do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%). do not use water-soluble flux. solder use sn-3.0ag-0.5cu solder 13.2. note for assembling < thermal shock > pre-heating should be in such a way that the temperature difference between solder and products surface is limited to 100c max. also cooling into solvent after soldering should be in such a way that the temperature difference is limited to 100c max. the mounting of 2.5mm pitch should be pr evented on flow soldering to avoid an excess of solder volume. < exclusive use of reflow soldering > nfe61ht332z2a9 can only be soldered with reflow. if it were soldered with flow, cracks might be caused in the ceramic body. so, reflow soldering shall be applied for products. 2.0 4.8 8.8 1.6 2.6 3.0 small diameter thru hole ? 0.4 resist copper foil pattern no pattern 1.5 3.8 4.8 9.0 0.6 1.2 3.2 3.6 (in mm) small diameter thru hole ? 0.4 resist copper foil pattern no pattern
reference spec. no. jenf243e-9101a-01 p 7 / 9 murata mfg. co., ltd. reference only 13.3. attention regarding p.c.b. bending the following shall be considered when designing p.c.b.'s and laying out products. (1) p.c.b. shall be designed so that products are not subject to the mechani cal stress for board warpage. products direction products shall be located in the sideways direction (length:a ? b) to the mechanical stress. (2) products location on p.c.b. near seam for separation. products (a,b,c,d) shall be located carefully so that products are not subject to the mechanical stress due to warping the board. because they may be subjected the mechanical stress in order of a ? c ? b ? d. 13.4. standard soldering conditions on flow soldering (e.g. double wave soldering), use the product in consideration of t he conditions of solder, solder temperature and immersion time (melting time) because longer soldering time may cause the corrosion of the electrode. on dipping soldering, use the product in consideratio n of the conditions of solder, solder temperature, flux, preheat and so on because de-wetting may be caused. standard soldering profile and the limit soldering profile is as follows. the excessive soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality. < flow solder ing profile > standard profil e limit profile pre-heating 150c , 60s min. heating 250c , 4s ~ 6s 265c 3c , 5s max. cycle of flow 2 times 2 times poor example good example b a seam slit a d b c b a lengh:a reference spec. no. jenf243e-9101a-01 p 8 / 9 murata mfg. co., ltd. reference only < reflow soldering profile > standard profile limit profile pre-heating 150c ~ 180c , 90s 30s heating above 220c , 30s ~ 60s above 230c , 60s max. peak temperature 245c 3c 260c , 10s cycle of reflow 2 times 2 times 13.5. printing of adhesive (flow soldering) adhesive amount shall be about 0.5mg for one position to obtain enough adhesive strength. the adhesive position is as follows. 13.6. solder paste printing for reflow ? standard printing pattern of solder paste. standard thickness of the solder paste should be 150 ? m to 200m. use the solder paste printing pattern of the right pattern. for the resist and copper foil pattern, use standard land dimensions. 13.7. reworking with soldering iron the following conditions shall be strictly followed when using a soldering iron. ?? pre-heating : 150c, 1 min ?? soldering iron output : 30w max. ?? tip temperature : 350c max. ? tip diameter : 3mm max. ?? soldering time : 3(+1,-0) s ? times : 2times max. note: do not directly touch the products with the tip of th e soldering iron in order to prevent the crack on the ceramic material due to the thermal shock. 1.5 4.8 8.8 1.6 2.6 (in mm) 1.5 4.8 0.6 9.0 1.2 3.2 (in mm) adhesive position of adhesive limit profile standard profile 90s30s 230c 260c 245c3c 220c 30s 60s 60s max. 180 150 temp. time.(s) (c)
reference spec. no. jenf243e-9101a-01 p 9 / 9 murata mfg. co., ltd. reference only 13.8. cleaning conditions products shall be cleaned on the following conditions. (1) cleaning temperature shall be limited to 60c max. (40c max. for ipa.) (2) ultrasonic cleaning shall comply with the following conditions, with avoiding t he resonance phenomenon at the mounted products and p.c.b. power: 20w / l max. frequency: 28khz to 40khz time: 5 minutes max. (3) cleaner 1. cleaner isopropyl alcohol (ipa) 2. aqueous agent pine alpha st-100s (4) there shall be no residual flux and residual cleaner after cleaning. in the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) other cleaning please contact us. 13.9. operating environment do not use this product under the following envir onmental conditions, on deterioratio n of the performance, such as insulation resistance may result from the use. (1) in the corrodible atmosphere (acidic gase s, alkaline gases, chlorine, sulf ur gases, organic gases and etc.) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. 13.10. resin coating it may affect on the product's performance when using resin for coating / molding products. so please pay your careful attention when you select resin. in prior to use, please make the reliability evaluation with the product mounted in your application set. 13.11. handling of a substrate after mounting products on a substrate, do not apply any stre ss to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removi ng a connector from the substrate or tightening screw to the substrate. excessive mechanical stress may cause cracking in the product. bending twisting 13.12. storage condition (1) storage period use the products within 12 months after delivered. solderability should be checked if this period is exceeded. (2) storage environment condition products should be stored in the warehouse on the following conditions. temperature : - 10 c to + 40 c humidity : 15 % to 85% relative humidity no rapid change on temperature and humidity don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability. ? products should be stored on the palette for the preventi on of the influence from humidity, dust and so on. ? products should be stored in the warehouse without he at shock, vibration, direct sunlight and so on. ? products should be stored under the airtight packaged condition. (3) delivery care should be taken when transporting or han dling product to avoid excessive vibration or mechanical shock. 14. ! notes (1)please make sure that your product has been evaluated in view of your specificat ions with our product being mounted to your product. (2)you are requested not to use our product deviating from the agreed specifications. (3)the contents of this reference specificati on are subject to change without advance notice. please approve our product specifications or transact the approval sheet for product specifications before ordering.
|
